Home 1st NEPCON JAPAN [September] 2022 [1st NEPCON JAPAN [September] 2022] PMT Package Foundry "Rewiring Package Prototype and Design" - PMT Co., Ltd.

1st NEPCON JAPAN [September] 2022 movie

[1st NEPCON JAPAN [September] 2022] PMT Package Foundry "Rewiring Package Prototype and Design" - PMT Co., Ltd.

September 21, 2022

[1st NEPCON JAPAN [September] 2022] PMT Package Foundry "Rewiring Package Prototype and Design" - PMT Co., Ltd.

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PMT Co., Ltd. is exhibited PMT Package Foundry “Rewiring Package Prototype and Design” at 1st NEPCON JAPAN [September] 2022.

website：https://www.pm-t.com/

We manufacture packages using the rewiring process.

As for the structure, unlike the conventional flip chip or ball grid array, it is

a pannote-type wear level package with rewiring that draws out the wiring directly.

At present, we are still making 22-inch substrates, but

we are aiming to manufacture wear-level packages with 6-inch substrates from this fall in
order to meet the needs of our customers . increase.

Our company is currently working on a small diameter substrate, so

there are some parts that are not suitable for production, so we mainly accept prototypes.

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