Home NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo 陶瓷精密加工 - Tokyo Electronics Industry Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo

陶瓷精密加工 - Tokyo Electronics Industry Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

陶瓷精密加工 - Tokyo Electronics Industry Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
Loading advertisement...
Preload Image
Up next

三軸感知器智慧型LPS 3D H720 - SURUGA SEIKI Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

Cancel
Turn Off Light
Auto Next
Repeat Repeat
Previous Video Prev
Next Video Next
  Add New Playlist

東京電子工業株式會社在2026年日本電子精密加工展覽會（NEPCON JAPAN 2026）上重點展示了其先進的陶瓷精密加工技術。該公司專注於陶瓷和玻璃等複雜材料的超精密加工，並以驚人的速度提供解決方案。Generated by Gemini

網站:https://tokyo-denshi.jp

Available Languages

日本語简体中文繁體中文ไทยMalayFilipinoPortuguêsDeutschFrançaisEspañolहिन्दी한국어Русскийالعربية
Post Views: 99
Tags 工具機/金屬加工日本機械/工業技術汽車（包括零件/機械）測試/測量與分析/精密機械物料搬運/氣動製造技術與工程運輸/物流/包裝電氣與電子（產品/機械）
Previous Video
maxresdefault-13.jpg

外國關聯半導體積體電路 - Rebound Electronics Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

Next Video
maxresdefault-16.jpg

三軸感知器智慧型LPS 3D H720 - SURUGA SEIKI Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

Related videos

Top