NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo (Japan)

NEPCON JAPAN 2026 is an industry-first exhibition of new technologies, including mounting and manufacturing equipment, EMS and contract manufacturing, inspection and measurement equipment, electronic components and materials, printed wiring boards, microfabrication technology, semiconductor and sensor packaging technology, power device and power module technology.
The following events will be held simultaneously: the 40th Internepcon Japan – Electronics Manufacturing and Implementation Exhibition, the 40th Electrotest Japan – Electronics Inspection, Testing and Measurement Exhibition, the 27th Semiconductor and Sensor Packaging Exhibition – Specialized Exhibition for Semiconductor Post-Processing (commonly known as ISP), the 27th Electronic Components and Materials EXPO, the 27th Printed Wiring Board EXPO (commonly known as PWB), the 16th Microfabrication EXPO, and the 3rd Power Devices and Modules EXPO.

The event will be held for three days from Wednesday, January 21st, 2026 to Friday, January 23rd, 2026 at Tokyo Big Sight.

The official website for the 40th NEPCON JAPAN -Electronics Development and Packaging Exhibition- 2026 is here:
https://www.nepconjapan.jp/tokyo/ja-jp.html