What is NEPCON JAPAN?|International Exhibition for Electronic Components, Semiconductors, Packaging Technologies, Inspection Equipment and Electronics Manufacturing
What is NEPCON JAPAN?
NEPCON JAPAN is an international specialized exhibition covering electronic components and materials, semiconductors, packaging and mounting technologies, manufacturing equipment, inspection and measuring instruments, and other technologies that support the development and manufacturing of electronic equipment.
Advanced technologies supporting increasingly multifunctional and high-performance electronic equipment come together at the exhibition. Electronics manufacturers, semiconductor and sensor manufacturers, electronic component manufacturers, automotive and automotive electronics companies from Japan and overseas attend to solve technical challenges and develop new business partners.
The Tokyo edition consists of multiple specialized exhibitions and covers a wide range of processes across the electronics industry, from electronic components and materials to mounting and manufacturing, inspection and measurement, semiconductor back-end processes, power devices and contract manufacturing.
Event Overview
| Exhibition Name | 41st NEPCON JAPAN – Electronics R&D and Manufacturing Technology Expo – |
|---|---|
| Dates | February 17 (Wed)–19 (Fri), 2027 |
| Opening Hours | 10:00–17:00 |
| Venue | Tokyo Big Sight |
| Organizer | RX Japan Ltd. |
| Concurrent Specialized Shows | INTERNEPCON JAPAN, ELECTROTEST JAPAN, IC & Sensor Packaging Technology EXPO, Electronic Components & Materials EXPO, PWB EXPO, Fine Process Technology EXPO, Power Device & Module EXPO, EMS/Design Contract Manufacturing EXPO |
| Concurrent Exhibitions | AUTOMOTIVE WORLD, Factory Innovation Week |
| Number of Exhibitors | 1,800 companies (planned total including concurrent exhibitions) |
| Number of Visitors | 88,000 visitors (planned total including concurrent exhibitions) |
| Official Website | https://www.nepconjapan.jp/tokyo/ja-jp.html |
The exhibitor and visitor figures are planned figures for 2027 and are not confirmed results for NEPCON JAPAN alone.
Main Specialized Exhibitions
INTERNEPCON JAPAN
A specialized exhibition for electronics manufacturing and packaging technologies. Soldering, surface mounting, assembly, manufacturing equipment, mounting materials and related systems are presented.
ELECTROTEST JAPAN
An exhibition for inspection, testing and measurement technologies in electronics. Exhibits include visual inspection, electrical inspection, measuring instruments, test equipment and quality control systems.
IC & Sensor Packaging Technology EXPO (ISP)
A specialized exhibition covering back-end processes for semiconductors and sensors. Packaging materials, assembly equipment, bonding technologies, encapsulation technologies, inspection and evaluation equipment are presented.
Electronic Components & Materials EXPO
This exhibition covers electronic components, electronic materials, functional materials, adhesives and bonding materials, thermal management materials and other products related to the development and manufacturing of electronic equipment.
PWB EXPO
Technologies related to the development and manufacturing of electronic circuit boards are presented, including printed wiring boards, substrate materials, manufacturing and processing technologies, and inspection equipment.
Fine Process Technology EXPO
This exhibition covers technologies for high-precision manufacturing of electronic components, semiconductors and electronic equipment, including precision machining, laser processing, microfabrication, precision components and processing equipment.
Power Device & Module EXPO
Products supporting highly efficient power control are presented, including power semiconductors, power modules, related materials, mounting and bonding technologies, and evaluation and inspection technologies.
EMS/Design Contract Manufacturing EXPO
A specialized exhibition for services including contract electronics design, contract manufacturing, contract mounting, assembly and inspection.
It provides business opportunities between manufacturers seeking external partners for product development and manufacturing and EMS or contract design companies.
Main Exhibition Fields
Electronic Components and Electronic Materials
Components and materials used in electronic equipment are covered, including capacitors, connectors, sensors, substrate materials, insulating materials, adhesives and thermal management materials.
Mounting, Soldering and Assembly Technologies
Surface-mount equipment, soldering systems, bonding materials, assembly equipment and automation technologies for manufacturing processes are presented.
Semiconductor Back-End Processes and Advanced Packaging
Technologies supporting higher density and higher performance are covered, including semiconductor bonding, encapsulation, assembly, inspection and packaging materials.
Inspection, Measurement and Quality Control
Technologies supporting product quality assurance are presented, including visual inspection systems, X-ray inspection, electrical testing, measuring instruments and reliability evaluation systems.
Printed Wiring Boards and PCB Manufacturing
Printed wiring boards, flexible printed circuits, substrate materials, processing equipment and inspection systems are covered.
Power Devices and Power Control
Technologies for improving power conversion efficiency and reliability are presented, including power semiconductors, power modules, thermal management and bonding materials, and evaluation systems.
Microfabrication and Precision Components
Technologies supporting the miniaturization and higher precision of electronic equipment are covered, including precision cutting, laser processing, microforming and precision components.
EMS, Contract Design and Contract Manufacturing
Companies providing contract services for electronic circuit design, PCB design, prototyping, mounting, assembly, inspection and mass production are included.
Key Features of NEPCON JAPAN
From Electronic Components to Manufacturing, Mounting and Inspection
Visitors can compare a wide range of technologies related to electronics development and manufacturing, from selecting electronic components and materials to manufacturing, mounting, inspection and measurement.
Business Meetings with Electronics and Semiconductor Manufacturers
Professionals in R&D, design, production engineering, quality control and procurement conduct detailed discussions about product specifications and implementation requirements.
Supporting Higher-Performance Semiconductors and Sensors
Technologies supporting higher-performance semiconductors and electronic equipment gather at the exhibition, including advanced packaging, microfabrication, high-density mounting, thermal management and bonding technologies.
Connections with the Automotive and Automotive Electronics Sectors
As the exhibition is held concurrently with AUTOMOTIVE WORLD, exhibitors have opportunities to approach companies involved in automotive electronic components, power devices and electronic control technologies.
Expansion of EMS and Contract Design
In 2027, EMS/Design Contract Manufacturing EXPO will be newly added, expanding business opportunities related to outsourced electronics development and manufacturing.
Exhibition Scale
The organizer plans for 1,800 exhibitors and 88,000 visitors for the 2027 event.
These figures represent the planned overall scale including concurrent exhibitions such as AUTOMOTIVE WORLD and Factory Innovation Week and are not results for NEPCON JAPAN alone.
Main Visitor Profiles
- R&D and design professionals at electronics manufacturers
- Semiconductor and sensor manufacturers
- Electronic component and material manufacturers
- Automotive and automotive electronics manufacturers
- Printed wiring board manufacturers
- Electronics manufacturing and mounting professionals
- Production engineering and manufacturing equipment professionals
- Quality control and quality assurance professionals
- Electronic component and material procurement professionals
- EMS, contract design and contract manufacturing companies
- Inspection and measurement equipment manufacturers
- Research institutes and universities
Key Trends in the Electronics Industry
Advanced Semiconductor Packaging
As semiconductors become more powerful and densely integrated, technologies such as advanced packaging, fine-pitch bonding, thermal management and inspection are becoming increasingly important.
Miniaturization and High-Density Mounting of Electronic Equipment
High-density mounting, microfabrication, substrate materials and bonding technologies are attracting attention as electronic equipment becomes smaller and more multifunctional.
Power Semiconductors and Electrification
As electric vehicles and industrial equipment become more energy efficient, the importance of power devices, power modules, thermal management materials and power control technologies is increasing.
Automation of Manufacturing and Inspection Processes
Efforts to improve productivity and enhance quality control through image inspection, AI, robotics and the use of manufacturing data are progressing.
Use of EMS and Contract Design Services
Electronics manufacturers are increasingly outsourcing parts of design, prototyping, manufacturing, mounting and inspection to external companies in order to shorten development periods and optimize manufacturing operations.
Stable Procurement of Electronic Components and Supply Chains
Diversifying suppliers of electronic components and materials and strengthening manufacturing and supply systems are becoming increasingly important for supply chain stability.
FAQ
What kind of exhibition is NEPCON JAPAN?
It is an international specialized exhibition covering electronic components and materials, semiconductors, mounting and manufacturing equipment, inspection and measuring instruments, printed wiring boards, power devices and related technologies.
What types of companies can exhibit?
Target exhibitors include electronic component and material manufacturers, semiconductor-related companies, mounting equipment manufacturers, inspection and measuring equipment manufacturers, PCB manufacturers, and EMS and contract design companies.
Is INTERNEPCON JAPAN the same exhibition?
INTERNEPCON JAPAN is one of the specialized exhibitions that make up NEPCON JAPAN. NEPCON JAPAN as a whole consists of multiple specialized exhibitions.
Are the Tokyo Autumn and Osaka editions the same exhibition?
They belong to the same NEPCON JAPAN series, but they are separate events with different dates and venues. This page covers the Tokyo edition held at Tokyo Big Sight in February.
When will the next edition be held?
The next edition is scheduled for February 17 (Wed)–19 (Fri), 2027 at Tokyo Big Sight.
Watch Exhibitor Videos
The videos shown below are randomly selected from this exhibition. To browse all videos from this exhibition, please see the “Featured Exhibitions by Year” section below.
[NEPCON JAPAN 2024] Robo Press Unit Automated Motorized - Finetech Co., Ltd.
Ceramic Precision Machining - Tokyo Electronics Industry Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
Three-Axis Sensor Smart LPS 3D H720 - SURUGA SEIKI Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
Eye FARM-box - Nippo Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
[NEPCON JAPAN 2024] HAST System - Hirayama Seisakusho Co.
Independent, Authorized Distributor for Hybrid Electronic Components - Quicksol Japan Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
[NEPCON JAPAN 2024] Digital Cable Stripper MKS725HS - MK
Foreign-Affiliated Semiconductor IC - Rebound Electronics Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
Rosin Solder Wire / Rosin Solder Tape - Uchihashi Estec Co.,Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
Featured Exhibitions by Year
NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo (Japan)
NEPCON JAPAN 2024 (Japan)
Benefits of Exhibiting
NEPCON JAPAN enables companies offering electronic components and materials, semiconductors, mounting equipment, inspection and measuring instruments, printed wiring boards, power devices and related products to conduct direct business discussions with specialist professionals from electronics, semiconductor and automotive-related manufacturers.
Because exhibitors can explain product performance and implementation benefits directly to professionals in R&D, design, production engineering, quality control and procurement, the exhibition can lead to discussions about component adoption, equipment installation, joint development and contract manufacturing.
Displaying actual electronic components and manufacturing equipment and conducting performance comparisons or operating demonstrations allows exhibitors to communicate technical features that may be difficult to convey through catalogs alone.
Because the event is held concurrently with AUTOMOTIVE WORLD and Factory Innovation Week, exhibitors can also connect with companies interested in automotive electronic components, manufacturing automation and DX.
Key Points for Exhibition Preparation
Before exhibiting, clearly identify the visitors you want to prioritize for business discussions, such as electronics manufacturers, semiconductor manufacturers, automotive and automotive electronics companies, PCB manufacturers and EMS companies.
For electronic components and materials, organize information such as electrical characteristics, dimensions, heat resistance, reliability, supply capacity and applicable standards.
For mounting and manufacturing equipment, prepare materials explaining production capacity, processing speed, accuracy, compatible boards, equipment dimensions, maintainability and connection requirements with existing production lines.
For inspection and measuring equipment, organize information on inspection targets, detection accuracy, measurement time, applicable standards and installation track records.
For semiconductor packaging and power device-related products, prepare information that engineers can compare, such as bonding technologies, thermal performance, reliability evaluation and application fields.
For EMS and contract design services, clearly explain supported processes, design and manufacturing systems, quality control, minimum lot sizes, mass-production capabilities and lead times.
If business discussions with overseas companies are expected, prepare English product catalogs, technical documents and product videos.
Estimated Exhibition Costs
Booth Space Fees
Exhibition fees vary depending on the number of booths, exhibition area, exhibitor category, application timing and decoration plan.
When demonstrating manufacturing equipment or inspection systems, confirm required electrical capacity, compressed air, internet access and installation conditions for heavy equipment.
Please check the latest booth fees and application conditions in the exhibition materials provided by the organizer.
Decoration and Booth Construction Costs
Decoration and booth construction costs vary depending on exhibition area, construction specifications, exhibited equipment, lighting and video equipment.
For one booth, a layout centered on product display counters and technical explanation panels may be suitable. For two booths, the demonstration area and business meeting area can be separated. For four or more booths, multiple products and demonstrations of large equipment can be combined.
Additional costs may apply when installing operating manufacturing or inspection equipment, dedicated power supplies, heavy-duty display platforms, monitors or LED displays.
It is recommended to obtain quotations from multiple booth contractors based on the same specifications and compare them.
Personnel Costs
In addition to sales representatives, assign development and design personnel or technical sales staff who can explain product specifications and manufacturing processes.
Having personnel who can answer technical questions can lead to more concrete discussions about product adoption and equipment installation.
If discussions with overseas companies are expected, consider assigning English-speaking staff as well.
Transportation and Logistics Costs
Budget for transportation, move-in and move-out, packing, insurance, installation and dismantling of electronic components, semiconductor-related equipment, mounting equipment, inspection and measuring instruments and display fixtures.
For precision equipment, consider vibration and shock protection, electrostatic discharge countermeasures and temperature and humidity control. For heavy equipment, confirm move-in routes and floor load limits.
Please confirm exact fees with the exhibition organizer.
Booth Examples by Size
1-Booth Stand
Suitable for introducing electronic components, semiconductor materials, bonding materials, thermal management materials, sensors and compact inspection equipment.
Combine product samples, performance comparison data, technical explanation panels and monitors to communicate product features within a short period of time.
2-Booth Stand
A layout separating live demonstrations of mounting equipment, inspection and measuring instruments or PCB manufacturing equipment from a technical consultation area can be effective.
By showing actual operation and measurement results, exhibitors can communicate product performance and implementation benefits more concretely.
4 Booths or More
This format is suitable for companies presenting multiple product series or technological fields.
The booth can combine operating equipment, technical demonstrations, product-category zones, seminars and business meeting areas.
When displaying large manufacturing equipment or machinery with moving parts, the design should take into account electrical power, safety equipment and visitor flow.
When selecting a booth contractor, check their experience with electronics and semiconductor exhibitions, track record in handling precision equipment, previous construction photographs and portfolio.
Key Points for a Successful Exhibition Booth
Visitor Flow Design
Separate the flow of visitors viewing products, engineers checking live equipment demonstrations and professionals seeking detailed business discussions.
For large equipment or machinery with moving parts, provide a safe viewing area and restrict access where necessary.
If technical consultation is a priority, design the booth so visitors can move naturally to meeting seats after viewing the equipment and explanation panels.
Visibility
Make the brand name, technology field and the problems solved by the product visible from the aisle.
Communicate technical benefits concisely with messages such as “Improve Mounting Accuracy,” “Reduce Inspection Time,” “Improve Thermal Performance,” “Automate Manufacturing Processes” and “Support High-Density Mounting.”
Displaying performance comparison charts and implementation examples can help engineers determine how the product relates to their own technical challenges.
Demonstration and Hands-On Experience Design
For mounting equipment and inspection systems, demonstrations showing actual operation and measurement procedures are effective.
For electronic components and materials, performance comparisons, measurement results, operating conditions and implementation examples can communicate technical characteristics more specifically.
For EMS and contract design services, it can also be effective to explain the process from design and prototyping through manufacturing and inspection using models or video.
When conducting demonstrations, consider power supply, heat generation, static electricity, moving parts and visitor safety.
Using Exhibition Videos
Showing a 2–3 minute product introduction video on monitors or LED displays inside the booth makes it possible to efficiently explain the operation of mounting equipment, semiconductor packaging processes, inspection and measurement procedures, and electronic component manufacturing processes.
Videos are particularly effective for presenting content that is difficult to reproduce at the exhibition venue, such as equipment operating in an actual factory, internal machine structures, microfabrication processes and before-and-after comparisons.
If information is intended for overseas electronics and semiconductor manufacturers and engineers, multilingual support such as English subtitles should also be considered.
By playing videos repeatedly, product information can continue to reach visitors even while staff are engaged in technical consultations or business discussions.
Another option is to film a company representative or technical specialist explaining a product at the exhibition and edit and distribute the footage as a 2–3 minute video on the same day or the following day.
The completed video can be reused on the company website, YouTube, social media, sales emails, product pages and materials for overseas distributors.
By continuing to publish the video on WorldTradeShow.tv(インターネット展示会.tv), product information can also reach engineers and corporate professionals in Japan and overseas who were unable to visit the exhibition.
Videos showing manufacturing equipment in operation or explaining the technical characteristics of electronic components can become long-term assets for sales activities and technical explanations even after the exhibition ends.
If a booth contractor can provide both booth construction and video production, the placement of operating equipment, lighting, monitors, LED displays, safety equipment and filming positions can be planned together from the design stage.
Visitor Acquisition Measures for Better Exhibition Results
Email Marketing
Send exhibition announcements to electronics manufacturers, semiconductor manufacturers, automotive and automotive electronics manufacturers, PCB manufacturers and existing customers.
Introduce exhibited products, technical features, implementation examples, planned demonstrations and the booth number to encourage advance meeting reservations.
Social Media
Use LinkedIn, YouTube and other platforms to share product operation videos, manufacturing processes, technical explanations and implementation examples.
Short videos explaining technical features can increase interest among R&D, design and production engineering professionals.
Invitations and Direct Messages
Send individual invitations and technical materials to electronics manufacturers, semiconductor manufacturers, automotive and automotive electronics companies that you want to develop as priority prospects.
Provide information about technical consultation opportunities and scheduled equipment demonstrations to encourage concrete meeting reservations.
Using an Exhibition Landing Page
Create a dedicated exhibition Landing Page containing exhibited products, booth number, technical specifications, implementation examples, product videos, catalogs and a technical consultation reservation form.
After the exhibition, the page can continue to serve as an information resource for companies considering component adoption, equipment installation or joint development.
Companies Available for Booth Construction and Exhibition Operation Consultation
When exhibiting at NEPCON JAPAN, it is important to select a booth contractor capable of handling technical displays involving electronic components, semiconductor-related equipment, mounting equipment, and inspection and measuring instruments.
Check whether the contractor can support precision equipment display platforms, move-in and installation of large equipment, live demonstration areas, electrical work, safety equipment, lighting, monitors and LED displays according to the exhibition requirements.
It is also possible to film product demonstrations and explanations by technical staff at the exhibition and edit them into 2–3 minute videos on the same day or the following day for use in communication during the event.
By continuing to publish the completed videos not only on the company website and social media but also on WorldTradeShow.tv(インターネット展示会.tv), product information can continue to reach electronics and semiconductor manufacturers and technical professionals in Japan and overseas after the exhibition ends.
Please see the booth construction company pages below.
SPORTEC Booth Design & Construction Companies
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