Techno Berkshire’s InvisiPac system aims to revolutionize cardboard packaging. Addressing scorching issues with hot melt adhesives, the system minimizes material burning and reduces maintenance. Automating adhesive application lowers labor costs for food, beverage, and pharma industries.
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Techno Berkshire Co.
website:https://techno-berkshire.com/
FOOMA JAPAN Web Site:https://www.foomajapan.jp/
FOOMA JAPAN, Asia’s largest food manufacturing exhibition, will be held again in 2025. The latest technologies and products from all fields related to food, from raw material procurement to manufacturing, logistics, and sales, will be gathered in one place, accelerating the solution of problems in the food industry and the creation of new value.
Attention will be focused on robotics technology that realizes automation and labor saving, and quality control systems that utilize AI. Many environmentally friendly technologies that contribute to sustainable food production will also be exhibited. Expectations are also high for solutions that lead to the solution of social issues, such as reducing food waste and making effective use of resources.
FOOMA JAPAN is a great opportunity to see the future of the food industry and seize business opportunities. At the next event, you will surely encounter something that will bring innovation to your business. Please come to the venue and experience cutting-edge technology and find hints for the future. We look forward to your consideration of exhibiting.
Generated by Gemini
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